STMicro's PowerFLAT 8 mm x 8 mm HV SiC, 650 V diodes offer 4 A, 6 A, and 8 A versions that ease design in low-space environments thanks to the compact package. The diode devices offer enhanced power integration plus maximized productivity and sustainability. The MSL1 devices comply with ultra-stringent application conditions due to its high overcurrent capability in FLAT packages.
Features
- Package height: < 1 mm
- High creepage package
- Negligible or no reverse recovery
- Temperature independent switching behavior
- High forward-surge capability
- Low drop-forward voltage
- Exceptional power efficiency
- ECOPACK®2 compliant
Applications
- SMPS for telecom
- Servers
- Factory automation
- Renewable energy
- UPS
- DIN rails
- High-frequency inverters for boost PFC, bootstrap, or clamping functions
