 |  | | |
| PartNumber | 40-6553-10 | 40-6553-16 | 40-6553-11 |
| Description | IC & Component Sockets DIP TEST SCKT TIN 40 PINS | IC & Component Sockets DIP TEST SCKT NICKEL 40 PINS | IC & Component Sockets DIP TEST SCKT GOLD 40 PINS |
| Manufacturer | Aries Electronics | Aries Electronics | - |
| Product Category | IC & Component Sockets | Sockets for ICs, Transistors | - |
| RoHS | Y | - | - |
| Product | Zero Insertion Force (ZIF) Sockets | - | - |
| Number of Positions | 40 Position | - | - |
| Contact Plating | Tin | - | - |
| Series | X55X | 55 | - |
| Brand | Aries Electronics | - | - |
| Mounting Style | PCB | - | - |
| Product Type | IC & Component Sockets | - | - |
| Factory Pack Quantity | 7 | - | - |
| Subcategory | IC & Component Sockets | - | - |
| Type | - | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | - |
| Packaging | - | Bulk | - |
| Termination | - | Solder | - |
| Operating Temperature | - | -55°C ~ 250°C | - |
| Mounting Type | - | Through Hole | - |
| Features | - | Closed Frame | - |
| Housing Material | - | Polyetheretherketone (PEEK), Glass Filled | - |
| Number of Positions or Pins Grid | - | 40 (2 x 20) | - |
| Pitch Mating | - | 0.100" (2.54mm) | - |
| Contact Finish Mating | - | Nickel Boron | - |
| Pitch Post | - | 0.100" (2.54mm) | - |
| Contact Finish Post | - | Nickel Boron | - |
| Contact Finish Thickness Mating | - | 50μin (1.27μm) | - |
| Contact Material Mating | - | Beryllium Nickel | - |
| Contact Finish Thickness Post | - | 50μin (1.27μm) | - |
| Contact Material Post | - | Beryllium Nickel | - |
| Өндіруші | Бөлім № | Сипаттама | RFQ |
|---|---|---|---|
Aries Electronics |
40-6553-10 | IC & Component Sockets DIP TEST SCKT TIN 40 PINS | |
| 40-6553-10 | IC & Component Sockets DIP TEST SCKT TIN 40 PINS | ||
| 40-6553-18 | IC & Component Sockets FORCE DIP TEST SCKT HIGH TEMP 40 PINS | ||
| 40-6553-16 | IC & Component Sockets DIP TEST SCKT NICKEL 40 PINS | ||
| 40-6553-11 | IC & Component Sockets DIP TEST SCKT GOLD 40 PINS |