S34ML04G200BHV000

S34ML04G200BHV000 Overview

Product belongs to the ML-2 series. Tray Alternate Packaging is the packaging method for this product SMD/SMT Mounting-Style Wide - 40 C to + 105 C operating temperature range for diverse applications BGA-63 Operational temperature range: -40°C ~ 105°C (TA) Interface: Parallel Voltage Supply Range: 2.7 V ~ 3.6 V Supplier device package: 63-BGA (11x9) This product comes with a 2G (256M x 8) memory size. FLASH - NAND memory type Operating frequency: 25ns The architecture of this product is Multiplane . This product uses FLASH memory for lightning-fast data processing. Parallel interface type 512 M x 8 Organization Capacity Maximum supply current: 30 mA The 8 bit. Maximum supply voltage of 3.6 V Minimum supply voltage is 2.7 V The product operates in Asynchronous mode.

S34ML04G200BHV000 Image

S34ML04G200BHV000 Specifications

• Manufacturer Cypress Semiconductor Corp
• Product Category Memory
• Series ML-2
• Packaging Tray Alternate Packaging
• Mounting-Style SMD/SMT
• Operating-Temperature-Range - 40 C to + 105 C
• Package-Case BGA-63
• Operating-Temperature -40°C ~ 105°C (TA)
• Interface Parallel
• Voltage-Supply 2.7 V ~ 3.6 V
• Supplier-Device-Package 63-BGA (11x9)
• Memory-Size 2G (256M x 8)
• Memory-Type FLASH - NAND
• Speed 25ns
• Architecture Multiplane
• Format-Memory FLASH
• Interface-Type Parallel
• Organization 512 M x 8
• Supply-Current-Max 30 mA
• Data-Bus-Width 8 bit
• Supply-Voltage-Max 3.6 V
• Supply-Voltage-Min 2.7 V
• Timing-Type Asynchronous

S34ML04G200BHV000 FAQ

• A: What is the Series of the product?

  Q: The Series of the product is ML-2.

• A: At what frequency does the Packaging?

  Q: The product Packaging is Tray Alternate Packaging.

• A: What is the Mounting-Style of the product?

  Q: The Mounting-Style of the product is SMD/SMT.

• A: At what frequency does the Operating-Temperature-Range?

  Q: The product Operating-Temperature-Range is - 40 C to + 105 C.

• A: Is the cutoff frequency of the product Package-Case?

  Q: Yes, the product's Package-Case is indeed BGA-63

• A: At what frequency does the Operating-Temperature?

  Q: The product Operating-Temperature is -40°C ~ 105°C (TA).

• A: At what frequency does the Interface?

  Q: The product Interface is Parallel.

• A: At what frequency does the Voltage-Supply?

  Q: The product Voltage-Supply is 2.7 V ~ 3.6 V.

• A: Is the cutoff frequency of the product Supplier-Device-Package?

  Q: Yes, the product's Supplier-Device-Package is indeed 63-BGA (11x9)

• A: Is the cutoff frequency of the product Memory-Size?

  Q: Yes, the product's Memory-Size is indeed 2G (256M x 8)

• A: Is the cutoff frequency of the product Memory-Type?

  Q: Yes, the product's Memory-Type is indeed FLASH - NAND

• A: What is the Speed of the product?

  Q: The Speed of the product is 25ns.

• A: Is the cutoff frequency of the product Architecture?

  Q: Yes, the product's Architecture is indeed Multiplane

• A: Is the cutoff frequency of the product Format-Memory?

  Q: Yes, the product's Format-Memory is indeed FLASH

• A: Is the cutoff frequency of the product Interface-Type?

  Q: Yes, the product's Interface-Type is indeed Parallel

• A: At what frequency does the Organization?

  Q: The product Organization is 512 M x 8.

• A: At what frequency does the Supply-Current-Max?

  Q: The product Supply-Current-Max is 30 mA.

• A: What is the Data-Bus-Width of the product?

  Q: The Data-Bus-Width of the product is 8 bit.

• A: What is the Supply-Voltage-Max of the product?

  Q: The Supply-Voltage-Max of the product is 3.6 V.

• A: Is the cutoff frequency of the product Supply-Voltage-Min?

  Q: Yes, the product's Supply-Voltage-Min is indeed 2.7 V

• A: Is the cutoff frequency of the product Timing-Type?

  Q: Yes, the product's Timing-Type is indeed Asynchronous