Molex's Coeur CST high-current interconnect system delivers between 30.0 A and 200.0 A of current and offers a wide range of configurations, connecting PCBs, bus bars, and cables. It is difficult to have perfect pin-to-socket alignment when mating two rigid PCBs or bus bars. A degree of float is needed in these situations to accommodate any misalignment there may be. Coeur CST high-current interconnect system provides up to 1.0 mm of float due to its unique design. This will serve to assure ease of mating and prevent potential damage to the socket contacts.
Dense electronic packaging demands low profiles, minimal protrusions above mated PCBs or bus bars, or both. Coeur CST high-current interconnect system offers a mated profile as low as approximately 5.00 mm. It can do so without the compromise of having to have large protrusion above or below the mated boards.
Power efficiency is critical to cost management in large power-consuming operations such as data centers. Coeur CST high-current interconnect system is designed with multiple contact beams per socket. This serves to assure a solid electrical performance (low voltage drop).